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Chemical Name |
Bis-(sodium sulfopropyl)-disulfide |
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Synonyms |
SPS |
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CAS No. |
27206-35-5 |
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EINECS No. |
248-324-3 |
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Molecular formula |
C6H12O6S4Na2 |
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Molecular weight |
354.4 |
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Molecular Structure |
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Details |
Appearance: White powder Assay: 95% or 90% min Melting point: 197~198℃ Addition level : 0.01~0.02g/l Consumption (g/KAH): 0.5~0.8
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Main Application |
It is used as brightening agent & functional grain refinement agent for copper plating and combined with DAE, EDEP and so on.
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Bis-(sodium sulfopropyl)-disulfide, commonly abbreviated as SPS, is a specialized organosulfur compound used primarily as a brightener additive in the electroplating industry—particularly for acid copper plating. It contains disulfide and sulfonate groups, making it highly effective in controlling deposit structure and appearance during metal plating.
1. Acid Copper Electroplating Brightener
SPS is widely used as a key brightener and grain refiner in acid copper baths, especially in the manufacturing of printed circuit boards (PCBs) and semiconductor components. It works synergistically with accelerators and suppressors to achieve uniform, high-gloss, fine-grained copper deposits.
2. Via-Filling and Microelectronic Applications
In advanced electronics manufacturing, SPS plays a crucial role in via-filling and damascene processes, promoting void-free copper deposition with excellent leveling characteristics—critical for high-density interconnects and IC fabrication.
3. Improved Deposit Morphology
SPS improves the microstructure of copper layers, resulting in smoother surfaces, better ductility, and lower internal stress. This is essential for ensuring mechanical reliability in electronic devices.
4. Stable and Water-Soluble Additive
Its high water solubility and chemical stability make it easy to integrate into plating baths with consistent performance across long production cycles.
5. Synergistic Performance
SPS works in conjunction with other additives like PEGs (suppressors) and thiourea derivatives (accelerators), enhancing overall control of plating speed, gloss, and deposit quality.
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