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Nickel sulfamate

0.0
0.0
1000
Sinônimos:
Nickel bis(sulphamidate); Sulfamic acid nickel(2+) salt (2:1)
Nº CAS:
13770-89-3
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+
:
0
1
palavra-chave:

nickel sulfamate

nickel sulfamate formula

nickel sulfamate solution

nickel sulphamate

Descrição
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Nome químico

Nickel sulfamate

Sinônimos

Nickel bis(sulphamidate); Sulfamic acid nickel(2+) salt (2:1)

Nº CAS.

13770-89-3

EINECS No.

 

Fórmula molecular

H4N2NiO6S2

Peso molecular

250.86

Estrutura Molecular

nickel sulfamate

Detalhes

Appearance: green crystal
Ensaio: 98% mín.
Insoluble matter: 0.02%max.
Cl: 0.005% max.
So4: 0.03% max.
Fe: 0.001% max.
Zn: 0.01% max.
Heavy metal(Cu): 0.005% max.
Alkali metal & Ca-Mg (in sulfate): 0.1% max.
Package: 25kg, 50kg per plastic drum

Aplicação principal

Used in the electronics industry, electroforming, nickel plating and gold plated, coinage, ep, nickel cadmium battery, etc.

 

Nickel sulfamate is a high-purity, water-soluble nickel salt primarily used in electroplating applications. With the chemical formula Ni(SO₃NH₂)₂·4H₂O, it provides excellent throwing power, low internal stress, and superior deposit ductility, making it ideal for high-performance nickel plating processes.

One of the key advantages of nickel sulfamate is its ability to produce smooth, bright, and highly adherent nickel coatings. It is widely used in electroforming, precision engineering, electronics, and aerospace components, where dimensional accuracy and structural integrity are critical. The compound supports high-speed plating with minimal stress in the deposit, which is especially important for thick nickel layers or detailed molds.

Nickel sulfamate is also a preferred choice in micromachining and MEMS (Micro-Electro-Mechanical Systems) manufacturing due to its purity and low impurity content, ensuring consistent and reliable plating results. Its compatibility with various additive systems allows for customizable plating characteristics, including hardness, brightness, and ductility.

In industrial applications, nickel sulfamate solutions are easy to control and maintain, offering stable pH and temperature behavior. The compound is typically used in concentrations ranging from 300–600 g/L of nickel, depending on the desired thickness and plating speed.

 

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