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Nickel sulfamate

0.0
0.0
1000
Nā huaʻōlelo like:
Nickel bis(sulphamidate); Sulfamic acid nickel(2+) salt (2:1)
Helu CAS:
13770-89-3
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1
huaʻōlelo:
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Inoa Kimia

Nickel sulfamate

Nā huaʻōlelo like

Nickel bis(sulphamidate); Sulfamic acid nickel(2+) salt (2:1)

CAS No.

13770-89-3

EINECS No.

 

ʻAno molekala

H4N2NiO6S2

Kaumaha molekula

250.86

Hoʻokumu Molecular

<trp-post-container data-trp-post-id='990'>Nickel sulfamate</trp-post-container>

Nā kikoʻī

Appearance: green crystal
ʻIke: 98% min.
Insoluble matter: 0.02%max.
Cl: 0.005% max.
So4: 0.03% max.
Fe: 0.001% max.
Zn: 0.01% max.
Heavy metal(Cu): 0.005% max.
Alkali metal & Ca-Mg (in sulfate): 0.1% max.
Package: 25kg, 50kg per plastic drum

Noi Nui

Used in the electronics industry, electroforming, nickel plating and gold plated, coinage, ep, nickel cadmium battery, etc.

 

Nickel sulfamate is a high-purity, water-soluble nickel salt primarily used in electroplating applications. With the chemical formula Ni(SO₃NH₂)₂·4H₂O, it provides excellent throwing power, low internal stress, and superior deposit ductility, making it ideal for high-performance nickel plating processes.

One of the key advantages of nickel sulfamate is its ability to produce smooth, bright, and highly adherent nickel coatings. It is widely used in electroforming, precision engineering, electronics, and aerospace components, where dimensional accuracy and structural integrity are critical. The compound supports high-speed plating with minimal stress in the deposit, which is especially important for thick nickel layers or detailed molds.

Nickel sulfamate is also a preferred choice in micromachining and MEMS (Micro-Electro-Mechanical Systems) manufacturing due to its purity and low impurity content, ensuring consistent and reliable plating results. Its compatibility with various additive systems allows for customizable plating characteristics, including hardness, brightness, and ductility.

In industrial applications, nickel sulfamate solutions are easy to control and maintain, offering stable pH and temperature behavior. The compound is typically used in concentrations ranging from 300–600 g/L of nickel, depending on the desired thickness and plating speed.

 

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