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3-mercaptopropanosulfonato de sódio

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Sinônimos:
3-Mercapto-1-propanesulfonic acid sodium salt; MPS
Nº CAS:
17636-10-1
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Descrição
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Nome químico

3-mercaptopropanosulfonato de sódio

Sinônimos

3-Mercapto-1-propanesulfonic acid sodium salt; MPS

Nº CAS.

17636-10-1

EINECS No.

241-620-3

Fórmula molecular

C3H7O3S2Na

Peso molecular

178.21

Estrutura Molecular

<trp-post-container data-trp-post-id='1010'>Sodium 3-mercaptopropanesulphonate</trp-post-container>

Detalhes

 

Aparência:  White glossy plate crystal

Assay: 85.0% min.

Solubility(at 20℃): In water approx.50% (slightly soluble in alcohols)

Addition level : 20~100mg/l

Packing: 25kg or 5kg / fiber drum or as required

 

Aplicação principal

In the electroplating industry MPS serves as a brightening agent in acid copper baths to improve the deposition of copper coatings for decorative and functional purposes. The use of MPS together with polyethers and non-ionic surfactants results in brilliant and ductile coatings. An additional combination with polymeric amines, dyestuffs and other thio compounds in possible as well.

 

 

Sodium 3-mercaptopropanesulphonate (MPSNa) is a water-soluble, organosulfur compound containing both a thiol (-SH) group and a sulfonate (-SO₃Na) group. Its unique combination of nucleophilicity, water solubility, and metal-surface affinity makes it highly valuable in electroplating, surface modification, and chemical synthesis.

1. Electroplating Additive (Brightener/Leveler)

MPSNa is extensively used as a brightener and grain refiner in acid copper electroplating baths, especially for printed circuit boards (PCBs) and semiconductor interconnects. It enhances the smoothness, brightness, and uniformity of the copper deposit by controlling the growth of copper crystals.

2. Via-Filling and Microelectronics Manufacturing

In advanced microelectronic fabrication, MPSNa plays a critical role in via-filling processes, helping to achieve void-free copper fills in small features, which is essential for high-density interconnects.

3. Gold and Silver Plating

It is also used in gold and silver plating solutions, where it improves adhesion, surface finish, and brightness. Its sulfur-containing structure helps bind to metal surfaces effectively.

4. Corrosion Inhibition

Thanks to its thiol group, MPSNa shows potential as a corrosion inhibitor for metals like copper and steel. It forms a thin protective layer that can help prevent oxidative damage in aqueous environments.

5. Chemical Intermediate and Modifier

In organic and polymer chemistry, MPSNa is employed as a building block or chain transfer agent, introducing thiol or sulfonic functionality into larger molecules. This is useful in polymer modification, gel formation, and surface functionalization.

 

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